Ejò bankanje Itọju Ẹgbẹ Meji Fun HDI
●Sisanra: 12um 18um 35um 70um
●Iwọn Iwọn: 1290mm, A le gige bi ibeere iwọn
●ID: 76 mm, 152 mm
●Ipari: Adani
●Ayẹwo le jẹ ipese;Akoko asiwaju: 7days
●Akoko Ifijiṣẹ: 15-20days
●Awọn alaye iṣakojọpọ: Okeere apoti Onigi
●Akoko: FOB, CIF.
●Nkan isanwo: 50% T/T idogo, isanwo iwọntunwọnsi ṣaaju gbigbe.
●Awọn ohun elo sisọnu iṣelọpọ iṣẹ ṣiṣe giga ṣe iṣelọpọ iṣelọpọ ti bankanje bàbà.
●Double-ẹgbẹ mu Ejò bankanje
●Pẹlu ga abuda agbara lati laminate
●Taara olona-Lamination lamination
●Ti o dara etchability
●Fọọmu ti a tọju jẹ Pink
●Multilayer tejede Circuit Board
●HDI (High iwuwo Interconnector) fun PCB
| Iyasọtọ | Ẹyọ | Ibeere | Ọna Idanwo | ||||||
| Apejuwe Bankanje |
| T | H | 1 | 2 | IPC-4562A | |||
| Sisanra ipin | um | 12 | 18 | 35 | 70 | IPC-4562A | |||
| Iwọn Agbegbe | g/m² | 107±5 | 153±7 | 285± 10 | 585± 20 | IPC-TM-650 2.2.12 | |||
| Mimo | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||
| Ròwú | Apa didan (Ra) | um | ≤3.0 | IPC-TM-650 2.2.17 | |||||
| Ẹka Matte (Rz) | um | ≤6 | ≤8 | ≤10 | ≤15 | ||||
| Agbara fifẹ | RT(23°C) | Mpa | ≥207 | ≥207 | ≥276 | ≥276 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥103 | ≥103 | ≥138 | ≥138 | |||||
| Ilọsiwaju | RT(23°C) | % | ≥2 | ≥2 | ≥3 | ≥3 | IPC-TM-650 2.4.18 | ||
| H.T.(180°C) | ≥2 | ≥2 | ≥2 | ≥3 | |||||
| Resistivity | Ωg/m² | ≤0.170 | ≤0.166 | ≤0.162 | ≤0.162 | IPC-TM-650 2.5.14 | |||
| Agbara Peeli (FR-4) | S ẹgbẹ | N/mm | ≥0.9 | ≥0.9 | ≥1.4 | ≥1.4 | IPC-TM-650 2.4.8 | ||
| Lbs/ni | ≥5.1 | ≥6.3 | ≥8.0 | ≥8.0 | |||||
| M ẹgbẹ | N/mm | ≥0.9 | ≥1.1 | ≥1.4 | ≥2.0 | ||||
| Lbs/ni | ≥5.1 | ≥6.3 | ≥8.0 | ≥11.4 | |||||
| Pinholes & porosity | Nọmbas | No | IPC-TM-650 2.1.2 | ||||||
| Anti-oxidization | RT(23°C) | Awọn ọjọ | 180 | / | |||||
| H.T.(200°C) | Iṣẹju | 40 | / | ||||||
Iwọn Standard,1295 (± 1) mm, Iwọn Iwọn: 200-1340mm.Le ni ibamu si telo ibeere alabara.
PCB Ejò bankanje Image
