Agbara ipata giga ti yiyi bankanje bàbà (RA Ejò bankanje pẹlu nickel plating)
JIMA Ejò jẹ ile-iṣẹ hi-tekinoloji ti o ṣe amọja ni iṣelọpọ ti bàbà konge giga ati bankanje yiyi ti jara alloy Ejò.Ile-iṣẹ naa ti kọja eto iṣakoso didara agbaye ISO9001 ati iwe-ẹri eto iṣakoso ayika agbaye ISO14001.Pẹlu ifihan ohun elo iṣelọpọ kilasi akọkọ ti kariaye ati imọ-ẹrọ, ile-iṣẹ le ṣe agbejade bankanje ti sisanra 4-100 μm ati iwọn ti o pọju 660 mm, eyiti o jẹ ki ile-iṣẹ tobi julọ ni agbara bankanje bàbà, pipe julọ ni awọn oriṣiriṣi ati awọn ga ni ọjọgbọn ni ti yiyi Ejò bankanje iwadi ati gbóògì ni China.
Ti o ṣe pataki ni iwadii, idagbasoke, igbega ati ohun elo ti awọn imọ-ẹrọ tuntun ati iṣelọpọ ti bankanje idẹ ti yiyi, JIMA Copper ti jẹ idanimọ bi Idawọlẹ Hi-tech, Ile-iṣẹ Iwadi Imọ-ẹrọ Imọ-ẹrọ ti Rolled Copper Foil, Ile-iṣẹ Imọ-ẹrọ Idawọlẹ ti agbegbe ati pe o jẹ apakan igbimọ ti China Nonferrous Irin Processing Association.Ile-iṣẹ le ni imurasilẹ pese ọpọlọpọ awọn pato ti bankanje itele ti o ga-giga ( bankanje lile, bankanje rirọ, bankanje ologbele-lile, bbl) ati bankanje itọju dada ( bankanje idẹ pẹlu ẹgbẹ matte pupa, bankanje bàbà pẹlu ẹgbẹ matte dudu, resistance ipata giga ti yiyi Ejò bankanje, bbl) .. Awọn ọja ti wa ni o gbajumo ni lilo ninu awọn aaye ti itanna shielding, ooru wọbia, grapheme conductive film gbóògì, Aerospace, rọ Ejò agbada awo, litiumu batiri, 5G ibaraẹnisọrọ, LED, ni oye mọto ayọkẹlẹ, drone, wearable itanna awọn ọja, ati bẹbẹ lọ, ati pe o jẹ idanimọ pupọ ati iyìn nipasẹ awọn alabara.
Ati okeere si Korea, Japan, Germany, awọn United States, Russia, India ati awọn orilẹ-ede miiran.
| Nkan | Alloy | Sisanra (um) | Iwọn (mm) | Ohun elo |
| Yiyi Ejò bankanje fun graphene | C1020 | 12um 18um 25um 35um 50um | ≤630 | Grapheme conductive film gbóògì |
| Yiyi Ejò bankanje pẹlu dudu / pupa itọju | C1100 | 6um 9um 12um 18um 22um 35um 50um 70um | ≤630 | LED ni irọrun, FCCL, Circuit Titẹ Rọ, awo idẹ ti o rọ, |
| Idẹ Idẹ Idẹ | C1100 | 6um 9um 12um 18um 35um 50um 70um | ≤630 | l Ibi ipamọ agbara, Agbara |
| Agbara ipata giga ti yiyi bankanje bàbà(RA Ejò Foil _with Nickel plating) | C1100 | 12um 18um 25um 35um 50um | ≤630 | Awoṣe mobile idotin.yoo loo fere ti Samsung mobile ẹrọ |
| Iyasọtọ | Ẹyọ | Ibeere | Ọna Idanwo | |||||
| Sisanra ipin | Um | 12 | 18 | 25 | 35 | 50 | GB / T29847-2013 | |
| Iwọn Agbegbe | g/m² | 107±3 | 160±4 | 222± 4 | 311±5 | 445±5 | GB / T29847-2013 | |
| Cu Purity (C1020) | % | ≥99.96 | GB/T5121 | |||||
| Dada roughness | sm | ≤0.2 | GB / T29847-2013 | |||||
| Agbara fifẹ | 180 ℃/30 iseju | N/mm² | 160-180 | 170-190 | 180-210 | 180-210 | 200-220 | GB / 129847-2013 |
| Oṣuwọn Elongation | 180 ℃/30 iseju | % | ≥7 | ≥8 | ≥9 | ≥11 | ≥13 | GB / 129847-2013 |
| Dada Didara | Awọ Aṣọ, Ko si Wrinkle, Ko si Scratche, Ko si Pit ati aaye Salient | |||||||
| Ipata Resistance | 5% NaCl,35℃,24h | OK | ||||||
| Ibi ipamọ Ipo |
| Iwọn otutu≤25°C, Ọriniinitutu ibatan≤60%, ọjọ 180 | ||||||
| Ọja Anfani |
| Irisi mimọ, Resistance Wear ti o ga julọ, Ati Atako Ipata | ||||||
1.Nickel plating Sisanra: 0.3-0.6um
2.Le ranse nikan ẹgbẹ plating ati ki o ė ẹgbẹ plating
3.Apeere Ipese
4.Export Onigi apoti package
5.ID: 76MM
RA Ejò bankanje & Onigi apoti Package Photos
