Kekere Coarsening Yiyipada Itọju Ejò bankanje

Gẹgẹbi bankanje idẹ ti a ṣe atunṣe-pada, ọja yii ni iṣẹ ṣiṣe etchability to dara julọ.O le ṣe kuru ilana iṣelọpọ ni imunadoko, ṣaṣeyọri iyara ti o ga julọ ati iyara bulọọgi-etching, ati ilọsiwaju oṣuwọn ibamu ti awọn PCBs.

Fi imeeli ranṣẹ si wa

Alaye ọja

ọja Tags

Ẹ̀kúnrẹ́rẹ́

●Sisanra: 12um 18um 35um 70um
●Iwọn Iwọn: 1290mm, a le ṣe gige bi ibeere iwọn
●Onigi apoti package
●ID: 76 mm, 152 mm
●Ipari: Adani
●Ayẹwo le jẹ ipese
●Akoko asiwaju: 15-30days
●Akoko: FOB, CIF ...
●Nkan isanwo: 50% T/T idogo, isanwo iwọntunwọnsi ṣaaju gbigbe.

Awọn ẹya ara ẹrọ

●Yiyipada mu Ejò bankanje
●Profaili kekere, pẹlu agbara peeli giga
●Fọọmu ti a tọju jẹ Pink
●Gẹgẹbi bankanje idẹ ti a ṣe atunṣe-pada, ọja yii ni iṣẹ ṣiṣe etchability to dara julọ.O le ṣe kuru ilana iṣelọpọ ni imunadoko, ṣaṣeyọri iyara ti o ga julọ ati iyara bulọọgi-etching, ati ilọsiwaju oṣuwọn ibamu ti awọn PCBs.

Ohun elo

●Igbohunsafẹfẹ giga, Ultra-high igbohunsafẹfẹ, lilo si igbimọ PPE
●Fine Circuit Àpẹẹrẹ
●O ti wa ni o kun loo ni multilayered lọọgan ati ki o ga-igbohunsafẹfẹ lọọgan.

Awọn ohun-ini Aṣoju ti Kekere Coarsening Yiyipada Itọju Ejò bankanje

Iyasọtọ			Ẹyọ	Ibeere				Ọna Idanwo
Sisanra ipin			um	12	18	35	70	IPC-4562A
Iwọn Agbegbe			g/m²	107±5	153±7	285± 10	585± 20	IPC-TM-650 2.2.12
Mimo			%	≥99.8				IPC-TM-650 2.3.15
Ròwú	Apa didan (Ra)		um	3.0				IPC-TM-650 2.2.17
	Ẹka Matte (Rz)		um	≤5.0	≤6.0	≤8.0	≤10
Agbara fifẹ	RT(23°C)		Mpa	≥276				IPC-TM-650 2.4.18
	H.T.(180°C)			≥138
Ilọsiwaju	RT(23°C)		%	≥4	≥4	≥8	≥12	IPC-TM-650 2.4.18
	H.T.(180°C)			≥3	≥4	≥4	≥4
Agbara Peeli (FR-4)			N/mm	≥1.0	≥1.2	≥1.4	≥1.8	IPC-TM-650 2.4.8
			Lbs/ni	≥5.7	≥7.4	≥8.0	≥10.2
Pinholes & porosity			Nọmbas	No				IPC-TM-650 2.1.2
Anti-oxidization		RT(23°C)	Awọn ọjọ	90
		H.T.(200°C)	Iṣẹju	30