Ami kekere ti Ejò bankanje (LP -SP / B)
●Sisanra: 12um 18umm 255um 50um 700 100umm
●Iwọn iwuwasi: 1290mm, le jẹ gige bi ibeere iwọn
●Package apoti onigi
●Id: 76 mm, 152 mm
●Ipari: ti aṣa
●Apejuwe le jẹ ipese
Yio fi eweko ti a lo ni akọkọ fun awọn PCBs multilayesered ati awọn igbimọ agbegbe iwuwo giga, eyiti o nilo ikogun ilẹ-ilẹ giga, awọn iṣe wọn bii resistance oju-aye deede le wa ni ipele giga. O jẹ ti ẹka pataki ti koriko Ecctrolytic gbẹ bankanje pẹlu iṣakoso ti o ni inira. Ti a ṣe afiwe pẹlu bankanctolytic electrolyntic deede Wọn ni awọn kilitari okuta kekere dipo awọn ọmọ alakọja, lakoko ti wọn ẹya awọn oke alapin ati ipele kekere ti koriko dada. Wọn ni iru awọn itọsi bii iduroṣinṣin iwọn to dara julọ ati lile ti o ga julọ.
●Profaili kekere fun FcCl
●Mit mit
●O tayọ etchality
●Inolu ti a tọju jẹ Pink tabi dudu
●3Layer fccl
●Em
Isọri | Ẹyọkan | Ibeere | Ọna idanwo | ||||||||
Sisanra ti o nipọn | Um | 12 | 18 | 25 | 35 | 50 | 70 | 105 | IPC-4562A | ||
Iwuwo agbegbe | G / M² | 107 ± 5 | 153 ± 7 | 225 ± 8 | 285 ± 10 | 435 ± 15 | 585 ± 20 | 870 ± 30 | IPC-TM-650 2.2.212 | ||
Awọn mimọ | % | ≥99.8 | IPC-TM-650 2.3.15 | ||||||||
aidajọ | Agbe Shinmere (RA) | m | ≤0.43 | IPC-TM-650 2.3.17 | |||||||
Matte ẹgbẹ (rz) | um | ≤4.5 | ≤5.0 | ≤6.0 | ≤7.0 | ≤8.0 | ≤12 | ≤14 | |||
Agbara fifẹ | RT (23 ° C) | Mppa | ≥207 | ≥276 | IPC-TM-650 2.4.18 | ||||||
Ht (180 ° C) | ≥138 | ||||||||||
Igbelage | RT (23 ° C) | % | ≥4 | ≥4 | ≥5 | ≥8 | ≥10 | ≥12 | ≥12 | IPC-TM-650 2.4.18 | |
Ht (180 ° C | ≥4 | ≥4 | ≥5 | ≥6 | ≥8 | ≥8 | ≥8 | ||||
Rsaeisviisi | Ω..com | ≤0.17 0 | ≤0.1 66 |
| ≤0.16 2 |
| ≤0.16 2 | ≤0.16 2 | IPC-TM-650 2.5.14 | ||
Reliofe (FR-4) | N / mm | ≥1.0 | ≥1.3 |
| ≥1.6 |
| ≥1.6 | ≥2.1 | IPC-TM-650 2.4.8 | ||
Piorholes & portic | Nọmba |
|
| No | IPC-TM-650 2.1.2 | ||||||
Anti-oṣeri | RT (23 ° C) | Doys |
|
| 180 | ||||||
Ht (200 ° C) | Iṣẹju |
|
| 30 |
Iwọn boṣewa, 1295 (± 1) mm, ibiti iwọn ti: 200-1340mm. Le ni ibamu si iru alabara alabara.
