Ultra Low Profaili Ejò Bankanje Fun 5G High igbohunsafẹfẹ Board
Fọọmu aise naa, eyiti o ni oju didan pẹlu aibikita kekere ni ẹgbẹ mejeeji, ni itọju pẹlu ilana micro-roughening kikan ti JIMA Ejò lati ṣaṣeyọri iṣẹ anchoring giga ati tun roughness kekere.O nfunni ni iṣẹ ṣiṣe giga ni awọn aaye lọpọlọpọ, lati awọn igbimọ Circuit ti a tẹjade lile ti o ṣaju awọn ohun-ini gbigbe ati iṣelọpọ ti apẹrẹ ti o dara si awọn iyika ti a tẹjade ti o rọ ti o ṣaju akoyawo.
●Profaili kekere Ultra pẹlu agbara peeli giga ati agbara etch to dara.
●Imọ-ẹrọ isokuso Hyper Low, microstructure jẹ ki o jẹ ohun elo ti o dara julọ lati lo si Circuit gbigbe igbohunsafẹfẹ giga.
●Fọọmu ti a tọju jẹ Pink.
●Ga igbohunsafẹfẹ gbigbe Circuit
●Ibudo mimọ / olupin
●Digital iyara to gaju
●PPO/PPE
| Iyasọtọ | Ẹyọ | Ọna Idanwo | Test Ọna | |||
| Sisanra ipin | Um | 12 | 18 | 35 | IPC-4562A | |
| Iwọn Agbegbe | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12.2 | |
| Mimo | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
| Irora | Apa didan (Ra) | sm | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
| Ẹka Matte (Rz) | um | 1.5-2.0 | 1.5-2.0 | 1.5-2.0 |
| |
| Agbara fifẹ | RT(23°C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
| HT(180°C) | ≥180 | ≥180 | ≥180 |
| ||
| Ilọsiwaju | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
| HT(180°C) | ≥6 | ≥6 | ≥6 |
| ||
| Pinholes & Porosity | Nọmba | No | IPC-TM-650 2.1.2 | |||
| Peel Agbara | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
| Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
| Anti-oxidization | RT(23°C) | Awọn ọjọ | 90 |
| ||
| RT(200°C) | Iṣẹju | 40 | ||||
